Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors-Reference-Cited by-同舟云学术

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Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Sippel Marcel¹,Hassel Simon²,Schmidt Ralf³,Sprenger Mario¹,Hecht Christoph¹,Franke Jorg¹

Affiliation:

1. Institute for Factory Automation and Production Systems (FAPS), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU),Nuremberg,Germany

2. Institute for Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU),Nuremberg,Germany

3. Competence Center Power Electronics, Siemens AG,Erlangen,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939542.pdf?arnumber=9939542

Reference12 articles.

1. A Study on the Effect of Microstructure Evolution of the Aluminum Metallization Layer on Its Electrical Performance During Power Cycling

2. Investigation of the fatigue behavior of Al thin films with different microstructure

3. Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling

4. Effect of Texture and Grain Size on the Deformation Behavior of Sputtered Thick Al-Si Films during Cyclic Heating and Cooling

5. Using the Chip as a Temperature Sensor - The Influence of Steep Lateral Temperature Gradients on the VCE(T)-Measurement

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1. A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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