1. Status of the Power Module Packaging Industry 2020: Market and Technology Report;Agarwal,2020
2. Comparison of Thermal Measurement Methods and Determination of Thermal Resistance of Die Attach Materials used in Power Electronic Modules;Duch
3. Comparison of different technologies for the die attach of power semiconductor devices conducting active power cycling;Hutter
4. Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
5. Plasma Powder Copper Coating on silicon substrates for copper wire bonds in comparison to state-of-the-art top-side interconnection technologies;Ockel