Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
Author:
Affiliation:
1. University of Twente, Enschede, AE, The Netherlands
2. Shenzhen Institute for Wide Bandgap Semiconductors (WinS), Shenzhen, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9911205/09864062.pdf?arnumber=9864062
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