Specially Structured AgCuTi Foil Enables High-Strength and Defect-Free Brazing of Sapphire and Ti6Al4V Alloys: The Microstructure and Fracture Characteristics

Author:

Liu Shaohong12,Liu Hairui1,Zhou Limin2,Cui Hao2,Liu Manmen23,Chen Li2,Wen Ming2ORCID,Dong Haigang2,Liu Feng2,Wang Wei1,Li Song1ORCID

Affiliation:

1. Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China

2. State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Yunnan Precious Metals Laboratory Co., Ltd., Kunming 650106, China

3. Sino-Platinum Metals Semiconductor Materials (Yunnan) Co., Ltd., Kunming 650106, China

Abstract

A novel AgCuTi brazing foil with a unique microstructure was developed, which could achieve strong vacuum brazing of Ti6Al4V (TC4) and sapphire. The brazing foil was composed of Ag solid solution (Ag(s,s)), Cu solid solution (Cu(s,s)), and layered Ti-rich phases, and had a low liquidus temperature of 790 °C and a narrow melting range of 16 °C, facilitating the defect-free joining of TC4 and sapphire. The sapphire/TC4 joint fabricated by using this novel AgCuTi brazing foil exhibited an outstanding average shear strength of up to 132.2 MPa, which was the highest value ever reported. The sapphire/TC4 joint had a characteristic structure, featuring a brazing seam reinforced by TiCu particles and a thin Ti3(Cu,Al)3O reaction layer of about 1.3 μm. The fracture mechanism of the sapphire/TC4 joint was revealed. The crack originated at the brazing seam with TiCu particles, then propagated through the Ti3(Cu,Al)3O reaction layer, detached the reaction layer from the sapphire, and finally penetrated into the sapphire. This study offers valuable insights into the design of active brazing alloys and reliable metal–ceramic bonding.

Funder

National Natural Science Foundation of China

Yunnan Key Research and Development Program

Scientific and Technological Project of Yunnan Precious Metals Laboratory

Publisher

MDPI AG

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