Reliability Enhancement of Thick Al–Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates
Author:
Affiliation:
1. Power and Industrial Division, Hitachi Ltd.
2. Graduate School of Science and Engineering, Ibaraki University
3. Department of Materials Science, Faculty of Engineering, Ibaraki University
4. The National Institute for Materials Science
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/53/2/53_M2011277/_pdf
Reference13 articles.
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4. 4) Y. Shimizu, Y. Tomota, J. Onuki, K. P. Khoo and T. Kurosu: Jpn. J. Appl. Phys. 48 (2009) 066511.
5. 5) T. Kurosu, Y. Shimizu, Y. Tomota and J. Onuki: Mater. Trans. 52 (2011) 102–107.
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