A Wiring Implementation Technology to Reduce the Inductance of the Power Module-Reference-Cited by-同舟云学术

A Wiring Implementation Technology to Reduce the Inductance of the Power Module

Published:2015 Issue:4 Volume:18 Page:270-278
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Nakatsu Kinya¹²,Miyazaki Hideki³,Saito Ryuichi³,Ohnuki Jin²

Affiliation:

1. Hitachi Research Labs., Hitachi, Ltd.

2. Materials Science and Engineering, Ibaraki University

3. Power Train Division, Hitachi Automotive Systems, Ltd.

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/18/4/18_270/_pdf

Reference15 articles.

1. 1) F. Luo, Z. Chen, L. Xue, and P. Mattavelli: “Design considerations for GaNHEMY multichip halfbridge module for high-frequency power converters,” APEC, 2014Twenty-Ninth Annual IEEE, 16-20 March 2014

2. 2) H. Satoshi, T. Takashi, T. Shigenori, and H. Noriyuki: “Low Inductance full SiC Power Module,” PCIM Europe 2014, Nuremberg Germany, Proceedings, Intelligent Motion, Renewable Energy and Energy Management, 20-22, May 2014

3. 3) M. Horio, Y. Iizuka, Y. Ikeda, E. Mochizuki, and Y. Takahashi: “Ultra Compact and High Reliable SiC MOSFET Power Module with 200°C Operating Capability,” ISPSD 2012, Bruges Belgium, Proceedings, 3-7 June 2012

4. 4) T. Kurosu, K. Khoo, Y. Nakamura, K. Ozaki, N. Ishikawa, and J. Onuki: “Reliability EnHancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al₂Cu Precipitates,” Mater. Trans., 53/ 1 (2012/01)

5. 5) K. Nakatsu, H. Suzuki, A. Nishihara, and S. Kouji: “Next-generation Inverter Technology for Environmentally Conscious Vehicles,” Hitachi Review, Vol. 61, No. 6, 2012

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