Author:
Kato Ikuhiro,Kato Tomohito,Terashima Hajime,Watanabe Hideto,Honma Hideo
Publisher
Japan Institute of Electronics Packaging
Reference10 articles.
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2. Effect of Electroless Nickel/Immersion Gold Finishing on BGA Solder Joints.
3. [4] F. Iwakura, Hyohmen Jissoh Gijutsu, No, 5 pp. 60, 1997 (In Japanease).
4. Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages.
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