Author:
CHINDA Akira,MIYAMOTO Nobuaki,YOSHIOKA Osamu
Publisher
The Surface Finishing Society of Japan
Cited by
6 articles.
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1. Gold Plating Films for Electronic Components;Journal of The Surface Finishing Society of Japan;2011
2. 10.4139/sfj.62.422;Journal of The Surface Finishing Society of Japan;2011
3. Influence of Electroless Ni-P Film Condition on Wire Bondability;Journal of The Surface Finishing Society of Japan;2011
4. Influences of Electroless Nickel Film Conditions on Electroless Au/Pd/Ni Wire Bondability;Transactions of The Japan Institute of Electronics Packaging;2010
5. Non-Cyanide Electroless Gold Plating Using Polyphenols as Reducing Agents;Journal of The Electrochemical Society;2006