Influence of Electroless Ni-P Film Condition on Wire Bondability-Reference-Cited by-同舟云学术

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Influence of Electroless Ni-P Film Condition on Wire Bondability

Published:2011 Issue:1 Volume:62 Page:47-53
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

KATO Ikuhiro,TERASHIMA Hajime,WATANABE Hideto,HONMA Hideo

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Reference10 articles.

1. Effect of Electroless Nickel/Displacement Gold Plating Process on Strength of Solder Joint

2. 3) A. Aiba, K. Kawamura, H. Shibuya ; Proceeding of the MES2005, p.357 (2005).

3. 4) 橋本滋雄, 上玉利徹 ; 第37回エレクトロニクス実装学会セミナー, p.58 (2004).

4. Evaluation of Substrate (Ni)-Catalyzed Electroless Gold Plating Process

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless Precious Metal Plating;Journal of The Surface Finishing Society of Japan;2019-09-01

2. Gold Plating Films for Electronic Components;Journal of The Surface Finishing Society of Japan;2011

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