Effect of Electroless Nickel/Immersion Gold Finishing on BGA Solder Joints.-Reference-Cited by-同舟云学术

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Effect of Electroless Nickel/Immersion Gold Finishing on BGA Solder Joints.

Published:2001 Issue:2 Volume:4 Page:124-127
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

SUGIZAKI Takashi,TAJIMA Kazutaka,SASAKI Tadashi,NAKAO Hidehiro,FUKUDA Yutaka,KIMURA Takashi

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep1998/4/2/4_2_124/_pdf

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 微細配線向け新規無電解貴金属めっきプロセスの開発と実装特性に関する研究;Journal of The Surface Finishing Society of Japan;2023-02-01

2. Study on Various Film properties of Electroless Ultra-Thin Ni/Pd/Au Plating Process for Fine Cu Pattern;Journal of The Surface Finishing Society of Japan;2022-03-01

3. Study on Influence of Ni Thin Film Formation on Various Surface Mounting Characteristics in Electroless Ni/Pd/Au Plating Process;Journal of The Surface Finishing Society of Japan;2021-02-01

4. Influence of Cleaning and Soft Etching for Electroless Palladium/Gold Plating on Copper Fine Pattern;Journal of The Surface Finishing Society of Japan;2017-08-01

5. Influences of Electroless Nickel Film Conditions on Electroless Au/Pd/Ni Wire Bondability;Transactions of The Japan Institute of Electronics Packaging;2010

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