Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process-Reference-Cited by-同舟云学术

Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process

Published:2020 Issue:0 Volume:13 Page:E19-013-1-E19-013-9
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Endo Shinichi¹,Habu Tomoyuki²,Yabu Shintaro³

Affiliation:

1. System Solution Division, Ushio Inc.

2. Process Collaboration Group, Ushio Technology laboratory, Ushio Inc.

3. Ushio America Inc.

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/13/0/13_E19-013-1/_pdf

Reference10 articles.

1. [1] J. Y. Xie, "Developing High Density Packaging with Low Cost Stacking Solution," in SEMICON WEST 2013, October 2013.

2. [2] T. Habu, "A Photo-Desmear Method for Via Residue Removal Using A VUV Light Source," in IMAPS 2013, October 2013.

3. [3] H. Horibe, "A photo-desmear process using a VUV light source," in The Japan Institute of Electronics Packaging 2014, March 2014.

4. [4] T. Habu, "Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substrates," in IMAPS 2015, 48th International Symposium in Microelectronics, October 2015.

5. [5] H. Suzuki, "Photodesmear Applicability for Blind Via Holes on a Build-up Substrate," in The Japan Institute of Electronics Packaging 2016, March 2016.

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