Fine Copper Lines with High Adhesion on High Rigidity Dielectrics
Author:
Affiliation:
1. Showa Denko Materials Co., Ltd.,Packaging Solution Center,Kawasaki,Japan
2. Showa Denko Materials Co., Ltd.,Laminate Materials R&D Dept,Ibaraki
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816723.pdf?arnumber=9816723
Reference31 articles.
1. Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications
2. Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process
3. Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA
4. Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology
5. Impact of Organic Substrate Warp on C4 Non-Wets
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3. High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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