High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics-Reference-Cited by-同舟云学术

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High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Nishida Masataka¹,Noma Hirokazu¹,Segawa Kouta¹,Iwakura Tetsuro²,Yamaguchi Masaki²,Han Younggun³,Onozeki Hitoshi¹,Mitsukura Kazuyuki⁴

Affiliation:

1. Packaging Solution Center, Resonac Corporation,Kawasaki, Kanagawa,Japan

2. Resonac Corporation,Laminate Materials R&D Dept,Chikusei, Ibaraki,Japan

3. Fukuoka University,Department of Electronic Engineering & Computer Science,Itoshima, Fukuoka,Japan

4. Packaging Solution Center, Resonac Corporation,San Jose,CA,America

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195824.pdf?arnumber=10195824

Reference14 articles.

1. Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs

2. Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission Property

3. Fine Copper Lines with High Adhesion on High Rigidity Dielectrics

4. Die Embedding Challenges for EMIB Advanced Packaging Technology

5. Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

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