Development on the Application of the SnAgCu Based Lead-Free Solder a Small Amount of the Added 5 Elements Solder of Industrial Electronic Equipment
Author:
Affiliation:
1. Fuji Electric Co., Ltd.
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/19/6/19_427/_pdf
Reference5 articles.
1. 5) T. Takemoto and A. Matsunawa: “Tensile Test for Estimation of Thermal Fatigue Properties of Solder Alloys,” Journal of Materials Science, Vol. 32, pp. 4077-4084, 1997
2. 9) E. P. Wood and K. L. Nimmo: “In Search of New Lead-Free Electronic Solders,” Journal of Electronic Materials, Vol. 23, No. 8, pp. 709-713, 1994
3. 13) S. K. Kang, R. S. Rai, and S. Purushothaman: “Interfacial Reactions During Soldering with Lead(Pb)-free Tin-Rich Solders,” Journal of Electronic Materials, Vol. 25, No. 7, pp. 1113-1120, 1996
4. 14) S. Terashima, Y. Kariya, and M. Tanaka: “Improvement on Thermal Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition,” Materials Transactions, Vol. 45, No. 3, pp. 673-680, 2004
5. 22) N. Hidaka, M. Nagano, M. Shimoda, H. Watanabe, and M. Ono: “Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy,” Proc. ASME, InterPACK2005, 2005-73148, 2005
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1. Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder;Journal of The Japan Institute of Electronics Packaging;2023-05-01
2. Class I Creep Deformation of Sn–Ag–Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints;MATERIALS TRANSACTIONS;2022-06-01
3. Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties;Journal of Smart Processing;2019
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