Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition
Author:
Affiliation:
1. Advanced Technology Research Laboratories, Nippon Steel Corp.
2. Eco-Materials Center, National Institute for Materials Science
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/45/3/45_3_673/_pdf
Reference13 articles.
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4. 4) H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer and M. Fine: J. Electron. Mater. 26 (1997) 783-790.
5. 5) S. Terashima, Y. Kariya, T. Hosoi and M. Tanaka: J. Electron. Mater. 32 (2003) 1527-1533.
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