Novel Development for Thermal Design of Electronic Equipment Using Pulsating Flow from Knowledge of Nature
Author:
Affiliation:
1. Department of Systems Innovation Engineering, Faculty of Science and Engineering, Iwate University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/21/2/21_114/_pdf
Reference10 articles.
1. 4) T. Fukue, T. Hatakeyama, M. Ishizuka, K. Hirose, K. Obata, and K. Koizumi: “Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment,” Proceedings of the ASME InterPACK2015 & ICNMM2015, 2015, Paper No., InterPACKICNMM2015-48600
2. 5) K. Obata, T. Fukue, K. Hirose, M. Kikuchi, Y. Ueda, S. Kusabuka, and T. Miyahara: “Enhancement of Water Cooling Performance in Narrow Flow Passages by using Micro Heat Sinks with Miniature Vortex Generators,” Proceedings of the ASME InterPACK2015 & ICNMM2015, 2015, Paper No., InterPACKICNMM2015-48607
3. 9) R. Kibushi, T. Hatakeyama, S. Nakagawa, and M. Ishizuka: “Thermal Properties of Power Si MOSFET by Considering Electron-Phonon Scattering Using Monte Carlo Simulation,” Transaction of The Japan Institute of Electronics Packaging, Vol. 8, No. 1, pp. 55-61, 2015
4. 11) T. Fukue, M. Ishizuka, T. Hatakeyama, S. Nakagawa, and K. Koizumi: “Study on P - Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan),” Proceedings of the ASME-JSME-KSME Joint Fluid Engineering Conference 2011, Paper No. AJK2011-22054
5. 12) T. Fukue, T. Hatakeyama, M. Ishizuka, K. Hirose, and K. Koizumi: “Relationships between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure,” Proceedings of the ASME InterPACK2013, Paper No., InterPACK2013-73089
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