Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Abstract

This study describes a prediction method of a supply flow rate of axial cooling fans mounted in high-density packaging electronic equipment. The performance of an air-cooling fan is defined by its P – Q (pressure difference – flow rate) curve. Generally the operating point of a fan, which is the operating pressure and the flow rate in equipment, is the point of intersection of a P – Q curve and a flow resistance curve. Recently, some researchers reported that catalogue P – Q curves have not necessarily been able to predict a correct supply flow rate in thermal design of high-density packaging equipment. Our study aims to improve prediction accuracy of the supply flow rate. In this report, a relationship between the P – Q curve and a pressure drop characteristic in a fan-mounted enclosure was investigated. A test enclosure which includes an obstruction was mounted in front of a test fan and the supply flow rate of the fan was measured while changing the obstruction. Additionally the flow resistance curves in the test enclosure were measured and the relationship among the supply flow rate, the P – Q curve and the flow resistance curve was investigated. It is found that the correct supply flow rate can be obtained by using the flow resistance from the enclosure inlet through the fan outlet and the revised P – Q curve which is made compensation for the pressure drop at the inlet and the outlet of the fan.