Author:
Zaferani Sadeq Hooshmand,Malhotra Abhishek,Sams Michael W.,Ghomashchi Reza
Reference138 articles.
1. Design and simulation of the CPU fan and heat sinks;Jian-Hui;IEEE Trans Comp Packag Technol,2008
2. A review on transient thermal management of electronic devices;Mathew;J Electron Packag,2022
3. Experimental investigation of thin PCM packages and thermal spreader for thermal management of portable electronic devices;Maranda;Appl Sci,2019
4. An overview of thermal management for next generation microelectronic devices;Tonapi,2003
5. Recent advances in thermal metamaterials and their future applications for electronics packaging;Kim;J Electron Packag,2021