A critical review of constitutive models for solders in electronic packaging
Author:
Affiliation:
1. School of Chemical Engineering and Technology, Tianjin University, Tianjin, P.R. China
Publisher
SAGE Publications
Subject
Mechanical Engineering
Link
http://journals.sagepub.com/doi/pdf/10.1177/1687814017714976
Reference82 articles.
1. A critical review of experimental results and constitutive descriptions for metals and alloys in hot working
2. Constitutive equations for hot-working of metals
3. Prediction of stress-strain relationship with an improved Anand constitutive Model For lead-free solder Sn-3.5Ag
4. Constitutive relations for tin-based solder joints
5. Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder
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