Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder-Reference-Cited by-同舟云学术

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Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder

Published:2000 Issue:3 Volume:23 Page:408-414
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Wilde J.,Becker K.,Thoben M.,Blum W.,Jupitz T.,Guozhong Wang ,Cheng Z.N.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/18678/00861554.pdf?arnumber=861554

Cited by 77 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical Characterization and Modeling of iSAC Lead-Free Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. The prediction method for the saturation stress of materials used in the Anand model parameters identification;Journal of Mechanical Science and Technology;2024-04

3. Numerical Characterization of the Mechanical Performance of SAC105 Tin-Silver-Copper Solder Interconnections After Aging;Annales de Chimie - Science des Matériaux;2023-12-22

4. Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents;Soldering & Surface Mount Technology;2023-08-28

5. Mechanical properties of IGBT module under Temperature Shock Test considering residual stress;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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