Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models-Reference-Cited by-同舟云学术

Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models

Published:2023-08 Issue:8 Volume:13 Page:1187-1201
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Gharaibeh Mohammad A.¹^ORCID,Wilde Jürgen²

Affiliation:

1. Department of Mechanical Engineering, Faculty of Engineering, The Hashemite University, Zarqa, Jordan

2. Institute for Microsystems Technology (IMTEK), Albert-Ludwig University of Freiburg, Freiburg, Germany

Funder

German Research Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference65 articles.

4. Reliability of copper baseplate high current power modules;fusaro;Int J Microcircuits Electron Packag,1997

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