Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study-Reference-Cited by-同舟云学术

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Published:2016-04-21 Issue:2 Volume:138 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Siow K. S.¹,Lin Y. T.²

Affiliation:

1. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor D.E., Malaysia e-mails: ;

2. Department of Business Management, College of Management, National Sun Yat-Sen University, No. 70, Lianhai Rd, Gushan District, Kaohsiung 804, Taiwan e-mail:

Abstract

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide band-gap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nano-Ag, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4033069/6045487/ep_138_02_020804.pdf

Reference120 articles.

1. Flexible Transparent Conductive Coatings by Combining Self-Assembly With Sintering of Silver Nanoparticles Performed at Room Temperature;J. Mater. Chem.,2011

2. Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications;ACS Appl. Mater. Interface,2015

3. Mechanical Properties of Nano-Ag as Die Attach Materials;J. Alloys Compd.,2012

4. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?;J. Electron. Mater.,2014

5. Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability;J. Electron. Mater.,2014

Cited by 100 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding;Journal of Materials Research and Technology;2024-01

2. High Strength die Attaching Structure Fabricated via in Situ Reduction-Sintering of Micron Copper Paste;2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-11-27

3. Study on the Performance of a Novel Mixed-Particle Silver Paste Sintered at 180 °C;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

4. Thermal reliability of Cu sintering joints for high-temperature die attach;Microelectronics Reliability;2023-08

5. Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08