Investigation of Effects of Porosity and Coarsening on Thermal and Mechanical Properties of Sintered Silver Die Attachment
Author:
Affiliation:
1. School of Integrated Circuits, Anhui University, Hefei, China
2. School of Materials Science and Engineering, Hefei University of Technology, Hefei, China
3. Advanced Forming Research Centre, University of Strathclyde, Renfrew, U.K.
Funder
Foundation for Introduction of High-Level Talents of Anhui University
University Synergy Innovation Program of Anhui Province
Research Foundation for the Introduction of Talent of Hefei University of Technology
Natural Science Foundation of Anhui Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx8/16/10645717/10589297.pdf?arnumber=10589297
Reference31 articles.
1. Die-attach materials for high temperature applications in microelectronics packaging;Siow,2019
2. State of the art of high temperature power electronics
3. Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm2 Power Cycling Tests
4. Porosity Dependence of Thermal and Electrical Properties in Nano-Silver Paste
5. Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
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