Funder
National Natural Science Foundation of China
Natural Science Fund of Tianjin, China
Ph. D. Programs Foundation of the Ministry of Education of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. A review on die attach materials for sic-based high-temperature power devices [J];Chin;Metall. Mater. Trans. B Process Metall. Mater. Process. Sci.,2010
2. Low-temperature sintering with nano-silver paste in die-attached interconnection [J];Wang;J. Electron. Mater.,2007
3. Die attach materials for high temperature applications: a review [J];Manikam;IEEE Trans. Compon. Packag. Technol.,2011
4. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device [J];Yamada;Microelectron. Reliab.,2007
5. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow [J];Zhang;IEEE Trans. Compon. Packag. Technol.,2002
Cited by
53 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献