High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures-Reference-Cited by-同舟云学术

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High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures

Published:2024-08 Issue: Volume:329 Page:118435
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Xin Jianbo,Gao Yue,Zhang Chenghao,Yang Le,Liu Sushi,Li Ke,Zhou Minghao,Liu Yang,Zhang Jing,Cai William

Funder

Key Research and Development Program of Heilongjiang

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference37 articles.

1. State of the art of high temperature power electronics;Buttay;Mater. Sci. Eng. B.,2011

2. Survey of high-temperature reliability of power electronics packaging components;Khazaka;IEEE Trans. Power Electron.,2014

3. Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics;Tuo;J. Mater. Process. Technol.,2021

4. Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air;Zhang;J. Alloy. Compd.,2019

5. Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties;Zhong;Mater. Des.,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review of Die-Attach Materials for SiC High-Temperature Packaging;IEEE Transactions on Power Electronics;2024-10

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