WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS-Reference-Cited by-同舟云学术

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WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS

Published:2017-10-28 Issue:4 Volume:12 Page:163-169
ISSN:1306-3111
Container-title:e-Journal of New World Sciences Academy
language:
Short-container-title:NWSA

Author:

Erer Ahmet Mustafa^ORCID

Publisher

NWSA Academic Journals

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility;npj Computational Materials;2023-10-23

2. Machine learning of the mechanical properties and data-driven design of lead-free solder alloys;SCIENTIA SINICA Technologica;2023-04-01

3. A new approach for measuring the wetting angles of lead-free solder alloys from digital images;Engineering Science and Technology, an International Journal;2022-12

4. Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate;Intermetallics;2021-01

5. Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate;International Journal of Modern Physics C;2020-07-20

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