Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate

Author:

Erer Ahmet Mustafa1,Turacı Mukaddes Ökten2

Affiliation:

1. Faculty of Science, Department of Physics, Karabük University, Karabük, 78050, Turkey

2. Yenice Vocational School, Department of Computer Programming, Karabük University, Karabük, 78700, Turkey

Abstract

This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

Publisher

World Scientific Pub Co Pte Lt

Subject

Computational Theory and Mathematics,Computer Science Applications,General Physics and Astronomy,Mathematical Physics,Statistical and Nonlinear Physics

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A new approach for measuring the wetting angles of lead-free solder alloys from digital images;Engineering Science and Technology, an International Journal;2022-12

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