A new approach for measuring the wetting angles of lead-free solder alloys from digital images-Reference-Cited by-同舟云学术

A new approach for measuring the wetting angles of lead-free solder alloys from digital images

Published:2022-12 Issue: Volume:36 Page:101279
ISSN:2215-0986
Container-title:Engineering Science and Technology, an International Journal
language:en
Short-container-title:Engineering Science and Technology, an International Journal

Author:

Sehirli Eftal,Erer Ahmet Mustafa,Turan Muhammed Kamil

Publisher

Elsevier BV

Subject

Metals and Alloys,Computer Networks and Communications,Fluid Flow and Transfer Processes,Hardware and Architecture,Mechanical Engineering,Biomaterials,Civil and Structural Engineering,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5 Cu solder alloy on Cu substrate;Erer;Eng. Sci. Technol., Int. J.,2018

2. Numerical computation of wetting angles of Sn–(3–x3−x)Ag–0.5Cu−x−x(Bi, In) quaternary Pb-free solder alloy systems on Cu substrate;Erer;Int. J. Mod. Phys. C,2020

3. Physicochemical properties of Sn-Zn and SAC + Bi alloys;Gancarz;J. Electron. Mater.,2013

4. A.M. Erer, and S. Oguz, Effect of bismuth on wettability of Sn-2.5Ag-0.5Cu-0.5Bi quaternary solder alloy on Cu substrate, in: AIP Conference Proceedings, 2042, (2018), https://doi.org/10.1063/1.5078880.

5. RoHS, Restriction of Use of Hazardous Substances, http://eur-lex.europa.eu/oj/direct-access.html, 2021 (accessed 02 November 2021).

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