The Evolution of Photolithography Technology, Process Standards, and Future Outlook-Reference-Cited by-同舟云学术

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The Evolution of Photolithography Technology, Process Standards, and Future Outlook

Published:2020-11-03 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
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Author:

Wu Qiang,Li Yanli,Zhao Yuhang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9278127/9278011/09278164.pdf?arnumber=9278164

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Top-Down Fabrication of Chemical and Biological Sensors;Accounts of Materials Research;2024-08-28

2. A Study on Cross-Level Interconnection of Metal Layers Under 193 Immersion Lithography Conditions;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

3. Improved BEOL Design Rules With 45-Degree Local Interconnection;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

4. A Study on the Resolution and Depth of Focus of ArF Immersion Photolithography;Micromachines;2022-11-14

5. A BEOL layout optimization method for advanced logic standard library cells;2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT);2022-10-25

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