A Study on Cross-Level Interconnection of Metal Layers Under 193 Immersion Lithography Conditions
Author:
Affiliation:
1. National Intergrated Circuit Innovation Center
2. School of Microelectronics, Fudan University,Shanghai,China,200433
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10531806/10531771/10532072.pdf?arnumber=10532072
Reference5 articles.
1. Improved BEOL Design Rules With 45-Degree Local Interconnection
2. Evolution and Updates of Advanced Photolithography Technology;Li;Laser & Optoelectronics Progress,2022
3. A Study of Improved Design Rules Through Allowing 45-Degree Metal Lines
4. The Variables and Invariants in the Evolution of Logic Optical Lithography Process
5. The Evolution of Photolithography Technology, Process Standards, and Future Outlook
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