A Study of Improved Design Rules Through Allowing 45-Degree Metal Lines-Reference-Cited by-同舟云学术

A Study of Improved Design Rules Through Allowing 45-Degree Metal Lines

Published:2022-06-20 Issue: Volume: Page:
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Container-title:2022 China Semiconductor Technology International Conference (CSTIC)
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Author:

Liu Xianhe¹,Li Yanli¹,Wu Qiang¹

Affiliation:

1. School of Microelectronics, Fudan University,Shanghai,China,200433

Publisher

IEEE

Link

Reference8 articles.

1. Exploring patterning limit and enhancement techniques to improve printability of 2D shapes at 3nm node;rehab;Proc SPIE,2020

2. Rule-based hotspot correction using a pattern matching flow;bradley;Proc SPIE,2021

3. A study of curvilinear routing in IN5 standard cells: challenges and opportunities (Poster Presentation);amit;Proc SPIE,2019

4. How utilizing curvilinear design enables better manufacturing process window;ryan;Proc SPIE,2020

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3. Improved BEOL Design Rules With 45-Degree Local Interconnection;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

4. Illumination Optimization for the Beol Dtco with 45 Degree Local Interconnection;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26