Improved BEOL Design Rules With 45-Degree Local Interconnection
Author:
Affiliation:
1. Fudan University, National Integrated Circuit Innovation Center,School of Microelectronics,Shanghai,China
Funder
Fudan University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10395907/10395930/10396008.pdf?arnumber=10396008
Reference6 articles.
1. Evolution and Updates of Advanced Photolithography Technology;Li;Laser & Optoelectronics Progress,2022
2. A study of curvilinear routing in IN5 standard cells: challenges and opportunities (Poster Presentation);Amit
3. EUV single patterning validation of curvilinear routing
4. A Study of Improved Design Rules Through Allowing 45-Degree Metal Lines
5. The Variables and Invariants in the Evolution of Logic Optical Lithography Process
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1. A Study on Cross-Level Interconnection of Metal Layers Under 193 Immersion Lithography Conditions;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
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