Publisher
Journal of Microelectronic Manufacturing
Cited by
4 articles.
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1. A Study on Cross-Level Interconnection of Metal Layers Under 193 Immersion Lithography Conditions;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Improved BEOL Design Rules With 45-Degree Local Interconnection;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24
3. A BEOL layout optimization method for advanced logic standard library cells;2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT);2022-10-25
4. Process Model Guided Photoresist Formulation Optimization;2021 International Workshop on Advanced Patterning Solutions (IWAPS);2021-12-12