Thermally Induced Losses on High Speed Interconnects
Author:
Affiliation:
1. Qualcomm Technologies, Inc,San Diego,CA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10241361/10241364/10241756.pdf?arnumber=10241756
Reference11 articles.
1. An approach for quantifying the conductor and dielectric losses in PCB transmission lines
2. Characterization of Transmission Lines on PCB from S-Parameters by Determining the Dielectric and Conductor Losses at the Crossover Frequency
3. Broadband Characterization of Copper Roughness by Comparing Striplines Fabricated on VLP and RTF Copper;romo l;IEEE International Symposium on Electromagnetic Compatibility and Signal Integrity,2020
4. Thermal Impact on High Speed PCB Interconnects
5. Signal Integrity Analysis of High Speed Channel considering Thermal Distribution
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