Funder
CONACyT-Mexico through Scholarship
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Thermally Induced Losses on High Speed Interconnects;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. An Improved Thru-Line De-Embedding Technique up to 80 GHz;IEEE Instrumentation & Measurement Magazine;2022-11
3. Temperature-Dependent Characterization and RLGC Model Implementation for a Printed Circuit Board Interconnect;IEEE Transactions on Microwave Theory and Techniques;2022-07
4. Dual-band gain-boosted planar lens antenna using a single layer metasurface for 6G applications;2022 Joint European Conference on Networks and Communications & 6G Summit (EuCNC/6G Summit);2022-06-07