An Improved Thru-Line De-Embedding Technique up to 80 GHz-Reference-Cited by-同舟云学术

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An Improved Thru-Line De-Embedding Technique up to 80 GHz

Published:2022-11 Issue:8 Volume:25 Page:32-37
ISSN:1094-6969
Container-title:IEEE Instrumentation & Measurement Magazine
language:
Short-container-title:IEEE Instrum. Meas. Mag.

Author:

Lv Shirong,Tang Fusheng,Jiao Mingqi,Zhang Shengli,Xie Liang

Funder

Huawei Technologies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation,Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/5289/9908262/09908272.pdf?arnumber=9908272

Reference11 articles.

1. A simple through-only de-embedding method for on-wafer S-parameter measurements up to 110 GHz;ito;IEEE Microwave Symposium Digest,0

2. Open-Thru de-embedding for graphene RF devices

3. A three-step method for the de-embedding of high-frequency S-parameter measurements

4. A de-embedding technique for interconnects;song;Proc IEEE Electrical Performance of Electronic Packaging Conf,0

5. Characterization of Transmission Lines on PCB from S-Parameters by Determining the Dielectric and Conductor Losses at the Crossover Frequency

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