Author:
Torres-Torres Reydezel,Vega-Gonzalez Victor H.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermally Induced Losses on High Speed Interconnects;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. Copper Roughness Induced Gain for Inductance and Resistance on Stripline Interconnects;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
3. Slew Rate Calibration Method for High Speed Systems;2022 International Conference on Electrical, Computer and Energy Technologies (ICECET);2022-07-20
4. Characterization of Transmission Lines on PCB from S-Parameters by Determining the Dielectric and Conductor Losses at the Crossover Frequency;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-05
5. Extraction of the Model Parameters for the Attenuation in Printed Transmission Lines;IEEE Microwave and Wireless Components Letters;2010-12