Author:
Pathania Sunil,Vasa Mallikarjun,Mutnury Bhyrav,Sharma Rohit
Cited by
8 articles.
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1. Thermally Induced Losses on High Speed Interconnects;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects;2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO);2023-06-28
3. Measurement of Temperature and Humidity Dependence of Automotive-Grade Interconnects;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07
4. Power Distribution Network Impedance Analysis considering Thermal Distribution;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12
5. Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09