Review on Process-Induced Strain Techniques for Advanced Logic Technologies-Reference-Cited by-同舟云学术

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Review on Process-Induced Strain Techniques for Advanced Logic Technologies

Published:2007-10 Issue: Volume: Page:
ISSN:
Container-title:2007 15th International Conference on Advanced Thermal Processing of Semiconductors
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Author:

Wiatr M.,Feudel Th.,Wei A.,Mowry A.,Boschke R.,Javorka P.,Gehring A.,Kammler T.,Lenski M.,Frohberg K.,Richter R.,Horstmann M.,Greenlaw D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4383794/4383795/04383814.pdf?arnumber=4383814

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3. Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices;Future Trends in Microelectronics;2016-09-19

4. Physical Design Considerations;Integrated Circuits and Systems;2009

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