Copper direct bonding for 3D integration
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4540055/4546905/04546926.pdf?arnumber=4546926
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration;Applied Surface Science;2023-02
2. Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electronics Packaging;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
3. Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions;2021 IEEE International 3D Systems Integration Conference (3DIC);2021-10
4. Effect of Annealing-Induced Tensions on the Mechanical Failure of Copper/Copper Interface in Wafer-to-Wafer Hybrid Bonding;ECS Journal of Solid State Science and Technology;2021-02-01
5. Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection;Nanopackaging;2018
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