Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-90362-0_22
Reference81 articles.
1. Lu D, Wong C-P (2009) Materials for advanced packaging: electrically conductive adhesives (ECAs). Springer-Verlag, USA
2. Stam F, O’Grady P, Barrett J (1995) Characterisation and reliability study of anisotropic conductive adhesives for fine pitch package assembly. J Electron Manuf 05(01):1–8. https://doi.org/10.1142/S0960313195000025
3. Chiu YW, Chan YC, Lui SM (2002) Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectron Reliab 42(12):1945–1951. https://doi.org/10.1016/S0026-2714(02)00097-5
4. Ishibashi K, Kimura J (1996) A new anisotropic conductive film with arrayed conductive particles. IEEE Trans Components Packag Manuf Technol Part B 19(4):752–757. https://doi.org/10.1109/96.544366
5. Caillat P, Massit C (2002) US6453553 B1, Method for making an anisotropic conductive coating with conductive inserts
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