CHARACTERISATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE PITCH PACKAGE ASSEMBLY-Reference-Cited by-同舟云学术

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CHARACTERISATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE PITCH PACKAGE ASSEMBLY

Published:1995-03 Issue:01 Volume:05 Page:1-8
ISSN:0960-3131
Container-title:Journal of Electronics Manufacturing
language:en
Short-container-title:Journal of Electronics Manufacturing

Author:

STAM F.,O'GRADY P.,BARRETT J.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://www.worldscientific.com/doi/pdf/10.1142/S0960313195000025

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection;Nanopackaging;2018

2. Integration of a capacitive pressure sensing system into the outer catheter wall for coronary artery FFR measurements;SPIE Proceedings;2017-05-30

3. A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications;Journal of Materials Science;2008-05

4. Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications;Journal of Adhesion Science and Technology;2008-01

5. Development of a RadFET linear array for intracavitary in vivo dosimetry during external beam radiotherapy and brachytherapy;IEEE Transactions on Nuclear Science;2004-08

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