Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations-Reference-Cited by-同舟云学术

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Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations

Published:2009-06 Issue: Volume: Page:
ISSN:
Container-title:2009 IEEE International Interconnect Technology Conference
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Author:

Carbonell Laureen,Volders Henny,Heylen Nancy,Kellens Kristof,Caluwaerts Rudy,Devriendt Katia,Sanchez Efrain Altamirano,Wouters Johan,Gravey Virginie,Shah Kavita,Luo Qian,Sundarrajan Arvind,Jiang Lu ,Aubuchon Joseph,Ma Paul,Narasimhan Murali,Cockburn Andrew,Tokei Zsolt,Beyer Gerald P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5069981/5090321/05090387.pdf?arnumber=5090387

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