Removal of Adsorbed Water on Si Wafers for Surface Activated Bonding
Author:
Affiliation:
1. Collaborative Research Center, Meisei University,Tokyo,Japan
2. School of Engineering, Tohoku University,Sendai,Japan
3. Bondtech Ltd. Co.,Kyoto,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10034668/10034662/10034710.pdf?arnumber=10034710
Reference9 articles.
1. Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method
2. Room temperature Cu–Cu direct bonding using surface activated bonding method
3. Quantification of wafer bond strength under controlled atmospheres
4. Surface activated bonding of silicon wafers at room temperature
5. Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass
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