Mechanism of Moldable Underfill (MUF) Process for RDL-1^st Fan-Out Panel Level Packaging (FOPLP)-Reference-Cited by-同舟云学术

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Mechanism of Moldable Underfill (MUF) Process for RDL-1^st Fan-Out Panel Level Packaging (FOPLP)

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Bu Lin,Che F. X.,Rao Vempati Srinivasa,Zhang Xiaowu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811049.pdf?arnumber=8811049

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on the yield optimization scheme of ESD devices based on FOPLP packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-08

3. Manufacturing for Reliability of Panel-Level Fan-out Packages;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022

4. A Quantitative Model to Understand the Effect of Gravity on the Warpage of Fan-Out Panel-Level Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11

5. Fan-In Wafer/Panel-Level Chip-Scale Packages;Semiconductor Advanced Packaging;2021

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