Author:
Ma Mike,Chen Stephen,Lai J. Y.,Lu Terrence,Chen Alex,Lin G. T.,Lu C. H.,Liu Cheng-Hsiang,Peng Shih-Liang
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Proposed package type for evaluating reliability of HBM Memory;Solid-State Electronics;2024-06
2. Effects of Plasma Treatment on Adhesion and Flow Behavior of Underfill in 2.5D Electric Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23
4. 7 Years after the A10 Processor, the Era of Heterogeneous Integration;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05
5. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01