Effects of Plasma Treatment on Adhesion and Flow Behavior of Underfill in 2.5D Electric Package-Reference-Cited by-同舟云学术

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Effects of Plasma Treatment on Adhesion and Flow Behavior of Underfill in 2.5D Electric Package

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Yang Yuanyuan¹,Fan Yixuan²,Zhu Caiping¹,Zhang Ruoyu¹,Yang Jinbao¹,Chen Jing¹,Xie Liangjun¹,Li Gang¹,Zhu Pengli¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China

2. Suzhou Institute for Advanced Research University of Science and Technology of China Shenzhen, China,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences,Suzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492400.pdf?arnumber=10492400

Reference10 articles.

1. A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

2. The Development and Technological Comparison of Various Die Stacking and Integration Options with TSV Si Interposer

3. Single-Phase Microfluidic Cooling of 2.5D-SICs for Heterogeneous Integration

4. Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2

5. Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages

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