Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545468.pdf?arnumber=7545468
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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2. Ab initio investigation of the elastic properties of bismuth-based alloys;Physical Review B;2019-09-06
3. Growth kinetics of bismuth nickel intermetallics;Journal of Materials Science: Materials in Electronics;2018-09-12
4. Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
5. Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding;Solid State Phenomena;2018-04
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