Affiliation:
1. University of Queensland
Abstract
This paper presents the use of the transient liquid phase concept to grow the high temperature Cu6Sn5intermetallic compound between Cu3Sn-rich powdered alloys and molten Sn. In this study, high temperature powdered alloys containing high fractions of Cu3Sn were fabricated from a chill-cast Sn-60 wt.%Cu alloy. A ternary alloy with composition of Sn-59 wt.%Cu-1 wt.%Ni was also prepared to investigate the effect of Ni. The reaction products were obtained at 250°C over a period of 30 minutes. The results provide new insight into the mechanism of the interfacial reaction between liquid Sn and solid Cu3Sn-rich alloy with and without Ni additions.
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
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