Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-93441-5_5
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2. Bajwa, A. A., & Wilde, J. (2016). Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices. Microelectronics Reliability, 60, 116–125. https://doi.org/10.1016/j.microrel.2016.02.016
3. Chen, W.-Y., & Duh, J.-G. (2017). Suppression of Cu3Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn–3.5Ag/Cu–15Zn transient liquid-phase bonding in novel 3D-IC technologies. Materials Letters, 186, 279–282. https://doi.org/10.1016/j.matlet.2016.10.006
4. Chen, H., Hu, T., Li, M., & Zhao, Z. (2017). Cu@Sn core-shell structure powder preform for high temperature applications based on transient liquid phase bonding. IEEE Transactions on Power Electronics, 32, 441–451. https://doi.org/10.1109/TPEL.2016.2535365
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